Open competition
Open procedure: the contract was advertised and any supplier could submit a bid.
Key facts
- Buyer
- University of Strathclyde · Body governed by public law
- Supplier
- Disco Hi-Tech UK Ltd SME
- Value
- £1,005,000
- Procedure
- Open procedure
- Sector
- Electrical equipment & lighting · Electronic equipment (CPV 31710000)
- Region
- Scotland
- Official notice
- 048485-2025 on Find a Tender
- Timeline
-
- Contract date30 Jul 2025
- Published13 Aug 2025Published 14 days after the contract date
Description
The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic …
About the supplier
Disco Hi-Tech UK Ltd: every public contract they have won.