Open competition
Open procedure: the contract was advertised and any supplier could submit a bid.
Key facts
- Buyer
- UK Research & Innovation · Body governed by public law
- Supplier
- HHV Ltd
- Value
- £185,067
- Procedure
- Open procedure
- Sector
- Mining & metals · Indium (CPV 14763000)
- Region
- South East
- Official notice
- 000402-2024 on Find a Tender
- Timeline
-
- Contract date20 Dec 2023
- Published5 Jan 2024Published 16 days after the contract date
Description
STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.
About the supplier
HHV Ltd: every public contract they have won, plus their Companies House record (company 06738557).